Core thesis
AI demand and process leadership can absorb a much larger manufacturing footprint.
Q2 2026 revenue increased 33.7% in U.S. dollars to $40.2 billion, HPC represented 66% of revenue, and 7-nanometer-and-below technologies produced 77% of wafer revenue. That mix gives TSMC a strong demand base for N2, A16, A14, and advanced packaging.